Ansys and Intel Foundry Join Forces for Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology
Ansys and Intel Foundry have announced a collaboration to expand their offerings from single-die system-on-chip (SoC) to include Intel’s embedded multi-die interconnect bridge (EMIB) assembly Technology. This innovative 2.5D chip assembly technology uses EMIB to connect die without the need for through-silicon vias (TSVs), providing higher speeds, lower power consumption, and greater reliability in advanced…

