Ansys and Intel Foundry have announced a collaboration to expand their offerings from single-die system-on-chip (SoC) to include Intel’s embedded multi-die interconnect bridge (EMIB) assembly Technology. This innovative 2.5D chip assembly technology uses EMIB to connect die without the need for through-silicon vias (TSVs), providing higher speeds, lower power consumption, and greater reliability in advanced silicon systems.
Ansys’ RedHawk-SC Electrothermal electronic design automation (EDA) platform enables multiphysics analysis of 2.5D and 3D-ICs with multiple dies, including thermal analysis with anisotropic thermal conduction. This is crucial for Intel’s new backside power distribution technology, as thermal gradients can lead to mechanical stresses and warpage that affect product reliability over time.
According to Rahul Goyal, Vice President & General Manager at Intel, the enablement of Intel 18A and EMIB technology offers significant advantages over traditional stacking techniques. Ansys is working closely with Intel to make the full benefits of this innovation accessible to joint customers, enabling them to create more competitive products.
John Lee, Vice President and General Manager of the electronics, semiconductor, and optics Business unit at Ansys, highlighted the collaboration with Intel Foundry in solving complex multiphysics challenges for higher performance products and a smooth user experience.
Overall, this collaboration between Ansys and Intel represents a significant advancement in 3D manufacturing technology, providing customers with the flexibility to adopt EMIB technology for their system architecture and assemble top-of-the-line solutions. These developments aim to meet stringent thermal, mechanical, performance, and reliability requirements in the ever-evolving tech industry.
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